FORM FACTOR |
Form Factor |
1OU – 3 Node OpenRack |
PROCESSORS |
Processor Number |
2 |
Processor Type |
AMD EPYC 7002/7003 |
Maximum TDP |
240W (@30C, Air Cool); 280W (with Direct to Chip Liquid Cooling) |
MOTHERBOARD |
Board Management |
BMC Chipset |
ASpeed AST2500 |
Dedicated BMC Interface |
Yes |
Shared BMC |
Yes |
IPMI 2.0 |
Yes |
Virtual Media Over LAN |
Yes |
KVM Over LAN |
Yes |
RedFish |
Yes |
Chipset |
SoC |
MEMORY |
Memory Type |
DDR4-3200MHz ECC |
Memory Capacity |
Up to 2TB (16 x DIMMs) Per Node |
STORAGE SYSTEM |
Hard Drive Bays |
2.5″ |
2x Fixed SATA SSD |
U.2 NVMe (2.5″) |
2x Fixed U.2 NVMe |
M.2 NVMe |
2x M.2 Drives per node |
NETWORKING |
Ethernet Controller |
Intel I350 |
On-Board LAN |
2x GbE/RJ45 |
PCI EXPANSION SLOTS |
Number of Slots/Gen/Speed (Size) |
2x PCIe Gen4 x16 (LP), 1x OCP Mezz |
MEZZANINE EXPANSION OPTIONS |
OCP Mezzanine |
Storage OCP Mezz |
LSI3008 Int. |
Network OCP Mezz |
Dual 10G/SFP+ (BCM57810S), Single 10G/SFP+ (BCM57811), Dual 10G/SFP+ (Intel 82599ES), Single 10G/SFP+ (Intel 82599EN) |
EXTERNAL I/O INTERFACES |
USB Ports |
2x USB 3.0 |
SUPPORTED OPERATING SYSTEM |
Supported OS |
RHEL, CentOS |
POWER SYSTEM |
Power Supply Size |
Not Applicable |
REGULATORY COMPLIANCE |
Regulations |
CE, FCC |
MOUNTING HARDWARE |
Rackmount Rails |
(OCP) Tundra ES Shelf |
OPERATING ENVIRONMENT |
Operating Temperature |
15C to 35C (59F to 95F) |
Non-operating Temperature |
-40C to 60C (-40F to 140F) |
Operating Relative Humidity |
8% to 80% (non-condensing) |
Non-operating Relative Humidity |
20% to 95% (non-condensing) |
SYSTEM DIMENSIONS & WEIGHT |
Height |
1.69 inches |
Width |
7 inches |
Depth |
35 inches |
Machine Weight |
Approximately 12.5 lbs |
Shipping Weight |
Approximately 22.5 lbs |
WARRANTY |
Warranty |
3 Year Standard; Up to 4 years on-site available |